Ps3 Cooling Pad

Effect Of Reflow Profile On SnPb And SnAgCu Solder Joint ...
One of the critical issues is the effect of reflow profile on lead-free solder melt, wet, and interact with the copper pad or other board metallization and component in the bulk solder (Salam, et al., 2004). Generally speaking, the faster cooling rate would result in ... Read Content

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Thermal Resistance - Wikipedia
Thermal resistance is a heat property and a measurement of a temperature difference by which an a thermal bonding pad or thermal transfer grease might be used to reduce the it concerns only packages having a single heat flow and an exposed cooling surface. Resistance in ... Read Article

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Understanding Thermal Dissipation And Design Of A Heatsink
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Thermal Airflow Considerations - Intel
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BGA IRDA-WELDER T-890 User Manual - Chinaemall.biz
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